ITO sputtering targets are made by mixing indium oxide and tin oxide powders in a certain proportion, processing them through a series of manufacturing processes, and then…
Blackish-gray ceramic semiconductor formed by high-temperature atmosphere sintering (1600 degrees Celsius, oxygen sintering).
Our company has introduced advanced design concepts from abroad and combined them with practical domestic production experience to develop a high-performance ITO sputtering furnace. This furnace solves the most challenging part of sputtering production—sintering—significantly improving product yield. The equipment boasts an internal oxygen purity exceeding 99.5%, maintaining a consistently slightly positive pressure atmosphere. It integrates degreasing and sintering, greatly saving energy and shortening the production cycle. The furnace temperature uniformity is generally within ±5℃, not exceeding ±10℃. The trolley uses a four-axis integrated sliding rail lifting system, ensuring safety and aesthetics. An optional equipment for treating organic gases generated during degreasing, which we call a waste gas purification furnace, can be added, providing employees with a healthy working environment and contributing to national environmental protection.
■ Firing of fine ceramics, electronic components, magnetic materials, and target materials.
